Introduction

ChargerLAB got an original GaN charger for 100W laptops from Lenovo. This charger is designed with its own cable, and the length of the cable is about 1.8 meters (5.9 feet). It supports 20V 5A PD fast charging and 5-21V 3A PPS fast charging. It is also compatible with phones.

Next, we are going to take it apart to see its internal components and structure.

Product Appearance

The charger is black. It benefits from the use of GaN technology so it is small in size.

Its case is made of fire-retardant PC with a matte surface.

There is a Lenovo logo on the front.

There is the word "100W" here, indicating the maximum output power of this charger.

It adopts a three-prong design.

The specs info are printed on the input panel.

Model is ADL100UDGC3A. It can support input of 100-240V 1.6A 50/60Hz. It can support output of 5V3A, 9V3A, 15V3A, and 20V5A.

There is a groove at the connection between the output cable and the adapter for protection.

The case of the USB-C connector is equipped with a circular groove to facilitate user plugging and unplugging.

The length of it is about 62 mm (2.44 inches).

The thickness is about 32 mm (1.26 inches).

The length of the output cable is about 178 cm (70.079 inches).

That's how big it is in the hand.

The weight is about 234 g (8.25 oz).

The ChargerLAB POWER-Z KM003C shows that USB-C can support PD3.0, PPS, QC5, and DCP charging protocols.

And it has four fixed PDOs of 5V3A, 9V3A, 15V3A, 20V5A, and two sets of PPS, which are 5-11V3A and 5-21V3A.

Teardown

Next, let's start to take it apart to see its internal components and structure.

First, remove the input and output covers.

The input wires are connected by soldering.

The output wires are also connected by soldering.

Cut off the connecting wires and take out the PCBA module. The PCBA module is wrapped with aluminum sheets for heat dissipation.

The length of the PCBA module is about 58 mm (2.28 inches).

The width is about 58 mm (2.28 inches).

The thickness is about 28 mm (1.1 inches).

The aluminum sheets are fixed with clips.

The heat sinks are soldered to the PCBA module.

This is the solder joint for the heat sink.

Remove the heat sinks. There is a mylar sheet between the heat sink and the PCBA module for insulation. The PCBA module is filled with potting compound for heat dissipation.

The fuse, safety X2 capacitor, common mode choke, bridge rectifier, PFC boost inductor, capacitor, and transformer are on the front of the PCBA module.

The back of the PCBA module has a hybrid-flyback controller, two MOSFETs, a feedback optocoupler, a synchronous rectifier controller, a synchronous rectifier, and a protocol chip.

ChargerLAB found it adopts a PFC+HFB hybrid flyback topology, with a wide-range output voltage.

Next, we will take a look at each component starting from the input end.

The fuse, common mode choke, and safety X2 capacitor are at the input end.

The input fuse is from CONQUER MST series and is used for input overcurrent protection. 3.15A 250V.

The safety X2 capacitor is from SCC. 0.33μF.

The common mode choke is wound with magnet and insulated wires, and it's also insulated with a bracket and tape.

The other common mode choke is also wound with magnet and insulated wires. And it's also insulated with a bracket.

The bridge rectifier, PFC controller, PFC MOSFET, and PFC rectifier are fixed on the side of the PCBA module. There are copper sheets and thermal pads corresponding to the MOSFET and rectifier positions to enhance heat dissipation.

Remove the side small PCB and the copper sheet.

The two bridge rectifiers, PFC controller, PFC MOSFET, and PFC rectifier are fixed on the side small PCB. 

There are no components on the back of the small PCB.

These are the two bridge rectifiers. Model is MB30KH. 3A 1000V.

The specification of this thin film capacitor is 0.68μF.

The other film capacitor has a specification of 1μF.

The filter inductor is wounded with a magnetic ring and insulated by a bracket.

The PFC controller is from Onsemi. It is based on an innovative Valley Synchronized Frequency Fold-back (VSFF) method, it operates in critical conduction mode (CrM) until the power drops below a threshold level. The VSFF maximizes the efficiency at both nominal and light loads. Model is NCP1623.

It will enter discontinuous conduction mode (DCM) with increased dead-time as the load further decays (frequency foldback).

The PFC MOSFET is from GaNext and adopts PQFN8x8 package. It has a high repetitive input voltage tolerance of ±20V. Model is G1N65R150PB-H. 650V 150mΩ.

Here is information about GaNext G1N65R150PB-H.

The magnetic core of the PFC boost inductor is wrapped with copper foil shield and insulated with tape.

The PFC rectifier is from STMicro and adopts DPAK package. 10A 600V. Model is STTH10LCD06.

The filter capacitor and transformer are on this side of the PCBA module.

The electrolytic capacitor is from NCC. 450V 82μF.

The HFB controller is from Infineon and adopts PG-DSO-14 package. It is a hybrid flyback controller. It integrates 600V high-voltage start-up cell for fast charging, and can drive both high and low-side MOSFETs. And the standby power consumption is less than 75mW. It simplifies the external components. Model is XPDS2201. 

The filter capacitor that supplies power to the master control chip is from AiSHi. 35V 47μF.

This MOSFET is from Infineon and adopts ThinPAK8*8 package. 650V 185mΩ. Model is IPL60R185C7.

The HFB PMOSFET is from STMicro and adopts DPAK package. Model is STD13N60M2. 650V 380mΩ.

This side has the transformer and the capacitor for output filtering.

The magnetic core of the transformer is insulated by tape.

This is the blue Y capacitor.

The optocoupler from LITEON is used for output voltage feedback regulation. Model is LTV1004.

The synchronous rectifier controller marked with IBUJR is from MPS and adopts TSOT23-6 package. It supports DCM, CCM, QR, ZVS, ACF (active clamp flyback), and HFB (hybrid-flyback). And its operating frequency can reach 1MHz, and supports synchronous rectifier GaN FET. Model is MP6951.

The synchronous rectifier is from Infineon and adopts PG-TDSON-8 package. Model is BSC040N10NS5. 100V 4mΩ.

The TVS diode used to absorb surge overvoltage is from Littelfuse. Model is SMAJ70A.

This is the solid capacitor for output filtering. 680μF 25V.

The electrolytic capacitor has the same specifications.

The protocol chip is from Weltrend. It supports USB PD3.0 and QC4+. It supports line loss compensation. Model is WT6636F.

The VBUS MOSFET is from APEC and adopts PMPAK3*3 package. Model is AP3NA4R2YT. 30V 4.2mΩ.

Well, those are all components of the Lenovo 100W GaN Charger.

Summary of ChargerLAB

Here is the component list of the Lenovo 100W GaN Charger for your convenience.

It adopts a three-prong design and it comes with a 1.8-meter-long output cable, which can meet most usage scenarios.

After taking it apart, we found it adopts a PFC+HFB hybrid flyback topology, with a wide-range output voltage. The transformer and power component are filled with potting compound to enhance heat dissipation. And the PCBA module is also wrapped with aluminum sheets. It is optimized for high-power continuous output scenarios to improve performance. 

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