Maxic Unveils MT5708: High-Density 36W Wireless Charging Chip for Slim Devices
Maxic Technology has recently introduced the MT5708 RTX chip, a high-performance solution designed to support the growing demands for compact, high-density power management in mobile and wearable devices. As smartphones become slimmer and more feature-rich, the need for high-power density and compact charging solutions has intensified. The MT5708 chip directly addresses this demand with its highly integrated design, allowing efficient high-power wireless charging in a space-saving format.
The MT5708 chip supports Qi 2.0 wireless charging protocols, including Basic Power Profile (BPP) and Extended Power Profile (EPP), as well as Maxic’s proprietary MPP protocol, enabling up to 36W of wireless charging power. Its efficient design incorporates full-bridge synchronous rectification, delivering up to 97% AC-DC conversion efficiency, which minimizes power loss and maximizes battery charging efficiency. Packaged in a compact 2.11mm x 3.36mm 40-WLCSP, the MT5708 reduces the space required on circuit boards, allowing manufacturers to design slimmer devices without sacrificing performance.
One notable feature of the MT5708 is its reverse wireless charging capability, offering up to 10W of reverse charging. This function allows devices like smartphones and power banks to transfer power to other compatible devices, enhancing user convenience and flexibility. The MT5708’s reverse charging mode is highly accurate, with a Q-value detection precision of less than 2%, making it a versatile solution for consumer electronics with diverse power needs.
The MT5708 chip also incorporates advanced power management features, including a 32-bit ARM Cortex M0 processor, 32KB of MTP memory, and multiple GPIO and I²C interfaces for design flexibility. With over-voltage, over-current, over-temperature, and short-circuit protection, the MT5708 ensures safe operation, enhancing durability and performance in high-power applications.
With the MT5708’s impressive specifications and compact design, Maxic Technology is paving the way for high-density, miniaturized power solutions. This chip aligns well with the needs of modern consumer electronics, particularly mobile and wearable devices, providing an effective combination of efficiency, flexibility, and compact power delivery.
Features:
- Power delivery: up to 36W(12V/3A)
- Power delivery in Tx mode: up to 10W
- Embedded with ARM Cortex M0 processor with 6KB SRAM and 32KB MTP
- AC to DC conversion efficiency: up to 97%
- Current-voltage accuracy:<1%
- Supports applications with low inductance coil
- Compliant with Qi 2.0 and supports 85KHz~2MHz operating frequency
- GPIO supports 1.8V and 1.2V in/out simultaneously
- Dual-channel ASK demodulation for reverse charging
- Q-value detection accuracy in Tx mode :<2%
- Designed with various protections: OVP, OCP, OTP, SCP, etc